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Characteristics under Bias-Temperature-Stress of Cu/Low-ka-SiCO:H Stru…

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  • 등록일 25-05-20
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Characteristics under Bias-Temperature-Stress of Cu/Low-ka-SiCO:H Structures Prepared by  Plasma Enhanced Chemical Vapor Deposition Using a Hexamethyldisilane Precursor and Cu  Sputtering

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